#author("2023-07-26T02:36:03+09:00","","")
3D-printed facet-attached microlenses (FaML) could overcome photonic packaging challenges - Phys.org
Photonic integrated circuits (PICs) are on the verge of significant disruption through the unlocking of novel applications. This success largely relies on advanced wafer-level miniaturized photonic de
Author : Science X
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